Interim Engineering Intern_2027_HW

Role Overview

Join Qualcomm, a global leader in mobile technology, as an Interim Engineering Intern (HW). This role offers the opportunity to work with inventive minds to transform 5G potential into world-changing technologies across industries such as automotive, healthcare, smart cities, and robotics.

Responsibilities

• Engage in SOC & Hard Macro Physical Design, including SOC Validation & Debug.
• Work on RF & Analog Layout and RF/Analog/Mixed Signal/Power IC Design.
• Support Low Power Design, Board and FPGA Design, and Digital ASIC Design.
• Assist in Design/SOC Verification, CAD Solution Engineering, Design for Test (DFT), and CPU Design.

Requirements

• Educational background in Electrical Engineering, VLSI, Embedded and VLSI, or ECE (Bachelors or Masters).
• Experience or knowledge in Verilog, VHDL, C/C++, or Tcl/Perl/shell-scripting.
• Understanding of RTL design or strong OO programming knowledge.
• For RF/Analog/Mixed Signal IC Design: Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, or SpectreRF is required.
• Excellent analytical, problem-solving, and collaborative teamwork skills.
• Good verbal and written communication skills.

Skills

• Verilog
• C/C++
• Cadence
• ASIC Design
• VLSI